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    The Corrosion Protection of Copper and Copper Alloys using an Electrodeposited Conducting Polypyrrole Coating


    Breslin, Carmel B. and Fenelon, Anna M. (2003) The Corrosion Protection of Copper and Copper Alloys using an Electrodeposited Conducting Polypyrrole Coating. Journal of Corrosion Science and Engineering. C012-C019. ISSN 1466-8858

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    Abstract

    Adherent polypyrrole films were electropolymerized from a near neutral sodium oxalate solution at pure Cu, CuZn and CuNi electrodes. The growth of these films was facilitated by the formation of a pseudo-passive oxalate layer. This layer was sufficiently protective to minimize dissolution of the substrate, but sufficiently conductive to enable the electropolymerization of pyrrole at the interface, and the generation of an adherent polypyrrole film. The rate of electropolymerization at the CuNi layer was reduced significantly by the formation of a nickel-rich oxide phase, however, the presence of Cu2+ increased the rate of polymer growth, enabling the formation of a thin polypyrrole layer during the early stages of polymerization. Likewise, the presence of zinc in the oxalate layer generated at the CuZn electrode reduced somewhat the rate of polymer formation. These films exhibited good corrosion protection properties in an acidified chloride solution.

    Item Type: Article
    Additional Information: Preprint of paper submitted to the Conference "Corrosion Science in the 21st Century", held at UMIST in July 2003.
    Keywords: Copper; Polypyrrole; Corrosion Protection; Electro- polymerization; oxalate;
    Academic Unit: Faculty of Science and Engineering > Chemistry
    Item ID: 7958
    Depositing User: Dr. Carmel Breslin
    Date Deposited: 22 Feb 2017 15:18
    Journal or Publication Title: Journal of Corrosion Science and Engineering
    Publisher: Center for Electrochemical Science and Engineering, University of Virginia
    Refereed: Yes
    Funders: Enterprise Ireland (EI)
    URI:

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