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    Identifying key process characteristics and predicting etch rate from High-Dimension Datasets


    Ragnoli, E. and McLoone, Sean F. and Lynn, S. and Ringwood, John and Macgearailt, N. (2009) Identifying key process characteristics and predicting etch rate from High-Dimension Datasets. Advanced Semiconductor Manufacturing Conference, 2009. . viii-ix. ISSN 1078-8743

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    Abstract

    In semiconductor manufacturing advanced process control (APC) refers to a range of techniques that can be used to improve process capability. As the dimensions of electronic devices have decreased, the application of APC has become more and more important for the critical stages of production processes. However, the economic disadvantage of employing APC is that it requires feedback information in the form of downstream metrology data, which is both time consuming and costly to obtain.

    Item Type: Article
    Keywords: Identifying key process characteristics; predicting etch rate; High-Dimension Datasets;
    Academic Unit: Faculty of Science and Engineering > Electronic Engineering
    Item ID: 1936
    Depositing User: Professor John Ringwood
    Date Deposited: 19 May 2010 13:53
    Journal or Publication Title: Advanced Semiconductor Manufacturing Conference, 2009.
    Publisher: IEEE
    Refereed: Yes
    URI:

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