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    Weighted windowed PLS models for virtual metrology of an industrial plasma etch process


    Lynn, Shane and Ringwood, John and MacGearailt, Niall (2010) Weighted windowed PLS models for virtual metrology of an industrial plasma etch process. In: IEEE International Conference on Industrial Technology (ICIT), March, 2010, Chile.

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    Abstract

    Virtual metrology is the prediction of metrology variables using easily accessible process variables and mathematical models. Because metrology variables in semiconductor manufacture can be expensive and time consuming to measure, virtual metrology is beneficial as it reduces cost and throughput time. This work proposes a virtual metrology scheme that uses sliding-window models to virtually measure etch rates in an industrial plasma etch process. The windowed models use partial least squares (PLS) regression and a sample weighting scheme to combat the effects of both process drifts due to machine conditioning and process shifts due to maintenance events. An industrial data set is examined and the weighted windowed PLS models outperform global models and non-weighted windowed models.

    Item Type: Conference or Workshop Item (Paper)
    Keywords: Weighted windowed PLS models; virtual metrology; industrial plasma etch process;
    Academic Unit: Faculty of Science and Engineering > Electronic Engineering
    Item ID: 3620
    Depositing User: Professor John Ringwood
    Date Deposited: 01 May 2012 14:39
    Refereed: Yes
    URI:

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