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    Polypyrrole electrodeposited on copper from an aqueous phosphate solution: Corrosion protection properties

    Redondo, Clara and Breslin, Carmel B. (2007) Polypyrrole electrodeposited on copper from an aqueous phosphate solution: Corrosion protection properties. Corrosion Science, 19 (4). pp. 1765-1776. ISSN 0010-938X

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    Highly adherent and homogenous polypyrrole films were electrodeposited at copper from a dihydrogen phosphate solution. The polypyrrole films were electrosynthesized in the overoxidized state by cycling the copper electrode from –0.4 to 1.8 V (SCE) in a pyrrole-containing phosphate solution. The growth of the polypyrrole films was facilitated by the initial oxidation of the copper electrode in the phosphate solution to generate a mixed copper–phosphate, copper oxide or hydroxide layer. This layer was sufficiently protective to inhibit further dissolution of the copper electrode and sufficiently conductive to enable the electropolymerization of pyrrole at the interface, and the generation of an adherent polypyrrole film. Potentiodynamic polarization measurements, Tafel analyses and open-circuit potential data revealed that the polypyrrole coating effectively protects the copper substrate from corrosion in a chloride solution. However, the corrosion protection properties were reduced with longer immersion times.

    Item Type: Article
    Keywords: A. Copper; B. Polymer coating; B. Cyclic voltametry; B. EIS;
    Academic Unit: Faculty of Science and Engineering > Chemistry
    Item ID: 7923
    Identification Number:
    Depositing User: Dr. Carmel Breslin
    Date Deposited: 14 Feb 2017 16:18
    Journal or Publication Title: Corrosion Science
    Publisher: Elsevier
    Refereed: Yes
    Use Licence: This item is available under a Creative Commons Attribution Non Commercial Share Alike Licence (CC BY-NC-SA). Details of this licence are available here

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