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    Agility and Information Technology Diffusion in the Semiconductor Industry


    Donnellan, Brian and Kelly, A. (2005) Agility and Information Technology Diffusion in the Semiconductor Industry. In: TDIT 2005: Business Agility and Information Technology Diffusion. IFIP International Federation for Information Processing book series (IFIPAICT, 180) . Springer, pp. 265-273. ISBN 9780387255903

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    Abstract

    New product development in the semiconductor industry is characterized by products with a high level of intellectual property content, and ever-decreasing product development cycles, designed by very scarce engineering talent. The foundation of the success of many semiconductor companies is their ability to respond quickly to turbulent market conditions. This ability is contingent on intra-organizational and interorganizational factors, which will be described in this paper. Firms are attempting to overcome these agility-related challenges by developing and deploying IT-based responses. This paper takes a practitioner perspective. The authors have a combined experience of over 35 years in the semiconductor industry.
    Item Type: Book Section
    Additional Information: Cite as: Donnellan B., Kelly A. (2005) Agility and Information Technology Diffusion in the Semiconductor Industry. In: Baskerville R.L., Mathiassen L., Pries-Heje J., DeGross J.I. (eds) Business Agility and Information Technology Diffusion. TDIT 2005. IFIP International Federation for Information Processing, vol 180. Springer, Boston, MA
    Keywords: Agility; IT diffusion; clockspeed; new product development; knowledge management; systems;
    Academic Unit: Faculty of Social Sciences > School of Business
    Item ID: 10795
    Depositing User: Prof. Brian Donnellan
    Date Deposited: 20 May 2019 16:14
    Publisher: Springer
    Refereed: Yes
    Related URLs:
    URI: https://mural.maynoothuniversity.ie/id/eprint/10795
    Use Licence: This item is available under a Creative Commons Attribution Non Commercial Share Alike Licence (CC BY-NC-SA). Details of this licence are available here

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