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Ma, Beibei, McLoone, Sean F. and Ringwood, John (2007) Tracking plasma etch process variations using Principal Component Analysis of OES data. In: ICINCO 2007, 4th International Conference on Information in Control, Automation and Robotics, 9 - 12 May, 2007, Angers, France. (Unpublished)
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Abstract
This paper explores the application of principal component analysis (PCA) to the monitoring of within-lot
and between-lot plasma variations that occur in a plasma etching chamber used in semiconductor
manufacturing, as observed through Optical Emission Spectroscopy (OES) analysis of the chamber exhaust.
Using PCA, patterns that are difficult to identify in the 2048-dimension OES data are condensed into a
small number of principle components (PCs). It is shown, with the aid of experimental data, that by simply
tracking changes in the directions of these PCs both inter-lot and intra-lot patterns can be identified.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Keywords: | Semiconductor manufacturing; Plasma etching; Metal etching; Optical emission spectroscopy (OES); Principal component analysis (PCA); Batch processing; |
| Academic Unit: | Faculty of Science and Engineering > Electronic Engineering |
| Item ID: | 1424 |
| Depositing User: | Professor John Ringwood |
| Date Deposited: | 08 Jun 2009 13:11 |
| Refereed: | Yes |
| Related URLs: | |
| Use Licence: | This item is available under a Creative Commons Attribution Non Commercial Share Alike Licence (CC BY-NC-SA). Details of this licence are available here |
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