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    Estimation and Control in Semiconductor Etch: Practice and Possibilities

    Ringwood, John and Lynn, Shane and Bacelli, Giorgio and Ma, Beibei Ma and Ragnoli, Emanuele and McLoone, Sean F. (2010) Estimation and Control in Semiconductor Etch: Practice and Possibilities. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 23 (1). ISSN 0894-6507

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    Semiconductor wafer etching is, to a large extent, an open-loop process with little direct feedback control. Most silicon chip manufacturers rely on the rigorous adherence to a “recipe” for the various etch processes, which have been built up based on considerable historical experience. However, residue buildup and difficulties in achieving consistent preventative maintenance operations lead to drifts and step changes in process characteristics. This paper examines the particular technical difficulties encountered in achieving consistency in the etching of semiconductor wafers and documents the range of estimation and control techniques currently available to address these difficulties. An important feature of such an assessment is the range of measurement options available if closed-loop control is to be achieved.

    Item Type: Article
    Keywords: Closed-loop control; plasma etch; run-to-run control; semiconductor wafer; state estimation; virtual metrology;
    Academic Unit: Faculty of Science and Engineering > Electronic Engineering
    Item ID: 1988
    Depositing User: Professor John Ringwood
    Date Deposited: 15 Jun 2010 15:57
    Publisher: IEEE
    Refereed: Yes
      Use Licence: This item is available under a Creative Commons Attribution Non Commercial Share Alike Licence (CC BY-NC-SA). Details of this licence are available here

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